Plasma surface modification and plasma chemistry
نویسندگان
چکیده
منابع مشابه
Plasma-surface modification of biomaterials
Plasma-surface modification (PSM) is an effective and economical surface treatment technique for many materials and of growing interests in biomedical engineering. This article reviews the various common plasma techniques and experimental methods as applied to biomedical materials research, such as plasma sputtering and etching, plasma implantation, plasma deposition, plasma polymerization, las...
متن کاملSurface chemistry during plasma etching of silicon
Angle-resolved x-ray photoelectron spectroscopy ( X P S ) and laserinduced thermal desorption (LD), combined with laser-induced fluorescence (LIF) detection, were used to study the etching of olycrystalline Si (poly-Si) and single crystal Si(lO0) in high density (1-2 x 10fl ions/cm3), low presswe (0.510 mTorr) C12MBr-containing, helical resonator plasmas. The XPS measurements on both unmasked S...
متن کاملPlasma Surface Modification for Selective Hydrophobic Control
The main objective of this research is theoretical and experimental investigation of the surfaces modification of SU8, PDMS, SiO2 and Si by RF plasma treatment. Physical-chemical reactions at room temperature can be used for the modifications of the surfaces in plasma, by modifying the contact angle, superficial polymerization, or by creating hydrophilic and/or hydrophobic regions on the surfac...
متن کاملSurface Modification of Titanium by Plasma Nitriding
A systematic investigation was undertaken on commercially pure titanium submitted to plasma nitriding. Thirteen different sets of operational parameters (nitriding time, sample temperature and plasma atmosphere) were used. Surface analyses were performed using X-ray diffraction, nuclear reaction and scanning electron microscopy. Wear tests were done with stainless steel Gracey scaler, sonic app...
متن کاملA Plasma Reactor for Solid Surface Modification
A general purpose plasma reactor has been designed and built to be used in various fields such as metallurgy, and microelectronics. The important aspects of the system design are : (a) the chamber can be evacuated to a base pressure of approximately 5 X 10-7 Tom; (b) capabilities for thermal bake out at 150°C, and nitrogen pre-burn at a pressure of about 3 X 10-3 Torr; (c) substrate holder whic...
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ژورنال
عنوان ژورنال: Plasma Physics and Controlled Fusion
سال: 1987
ISSN: 0741-3335
DOI: 10.1088/0741-3335/29/10a/316